LED Outlook Challenges Earnings and Exits for Manufacturers

Investment continues to flow to new LED entrants (Client registration required). But more established firms are still struggling to find their footing amid a heavy market oversupply. We expect the oversupply to abate after 2011 (Client registration required), due partly from increased demand fueled by China’s recent policy announcements (Client registration required). But low margins and anemic growth still weigh on major industry players.

This was underscored by earnings releases last month from Semileds, Cree, Veeco, and Philips do not bode well for a recovery. Semileds reported second quarter earnings with a net loss of $7.1 million on revenue of $7.9 million, down from $10 million the same quarter a year ago. More concerning, however, was Semileds’ outlook for the third quarter, where it expects a higher net loss of $7.5 million on $7.9 million to $8.9 million in revenue. Cree’s Q3 results delivered a drop in profit by half to $9.5 million on revenue of $284.8 million compared to the same quarter a year ago, while Veeco’s LED and solar EBITA dropped four-fold to $17.5 million on revenue of $96.0 million compared to the same quarter a year ago. Philips, meanwhile, saw adjusted EBITA for its lighting division fall by nearly half to €110 million on revenue of €2 billion compared to the same quarter a year ago.

Amidst these developments, cost-cutting has come into fashion. Osram, for example, is reportedly planning its first LED manufacturing plant in China in an effort to reduce manufacturing expenses. This move is too little too late, however. Unless Osram is planning to introduce its GaN-on-Si technology (Client registration required) at the new plant, it is unlikely to find itself in a better position, given the oversupply situation and the scale of its competitors in China. Although Osram has fared better than its LED peer Philips Lumileds, it’s well-known that parent Siemens is anxious to shed the unit. Indeed, Siemens CFO Joe Kaeser speculated the IPO for its Osram unit – put on hold last year – could be resurrected this fall if the LED market strengthens.

At Philips, CEO Frans van Houten acknowledged the near term challenges presented by the LED transformation, including “higher investments in R&D and selling expenses, as well as competitor pricing pressure.” But he remained convinced of the Lighting Group’s “profitable future.” It’s hard to share Houten’s optimism, however, given that Philips Lumileds has dragged its feet on cost reduction just like Osram. What’s more, Philips has been less aggressive than peers downstream, where companies like GE and Cree are capitalizing on the shift in value. In the end, Philips Lumileds best path forward may be to follow that of Philips Semiconductors, which was spun out in 2006 to form now publicly traded NXP.

Under the hood with power electronics at CES 2012

Last month, we flew to Las Vegas to attend the Consumer Electronics Show (CES), the world’s largest consumer technology trade show and the traditional – though waning – barometer of trends in the electronics industry. Amid aisle after aisle of the latest and greatest OLED displays and ultrabook computers, we ferreted out talk of a technology more often found under-the-hood than out-in-front, but no less important or innovative: power electronics.

NXP, a leading semiconductor company, supplies millions of power conversion devices to industries ranging from automotive and aerospace to consumer electronics and wireless. We stopped by its booth and struck up a discussion with application design manager Theo Kersjes on the merits and motivations for gallium nitride (GaN)-based power conversion devices. Theo’s outlook on GaN were far more tempered than wide-eyed start-ups like Transphorm or EPC, but he did argue that the technology has significant appeal for some markets even today, while others are quite distant. NXP is a major automotive supplier, and Theo quickly dismissed any near-term viability for GaN in anything beyond a concept car. While some power conversion developers like Freescale and Fuji Electric or even Transphorm are heralding the emerging EV market as a top target, Theo sees the overbearing reliability requirements and long lead time to integration as major barriers for EV adoption. This diagnosis is likely correct, and what’s more, the haltingly slow development of the EV market will be an additional inhibitor (see the report: Unplugging the Hype around Electric Vehicles).

As for top targets, Theo said NXP sees power supplies – specifically for consumer devices, not large-scale systems – as ripe for innovation. Theo said that size is the main driver, with efficiency an added bonus. The past few decades have seen an astounding miniaturization of devices, but Theo said that the power supply has only managed marginal reductions in size – and thus has evolved to account for an increasing percentage of valuable space. He sees silicon carbide (SiC) and GaN power conversion devices as a partial solution to this “real estate” dilemma. Since these materials are inherently capable of operating at a far higher frequency than traditional silicon-based devices, SiC and GaN enable the use of simpler and smaller passive components such as inductors, capacitors, heat sinks, and electromagnetic interference (EMI) packaging. The resulting power supplies can be one-third the size of those based on traditional silicon. Furthermore, GaN devices have a higher power density, and therefore reduce footprint compared to both silicon and SiC. While advanced active elements enabled by SiC and GaN are eliciting clear interest and development, an additional and currently unmet need is the further miniaturization of complementary passive components. Companies able to navigate or innovate around the laws of physics towards smaller passives will find plenty of customers waiting.