FLEX Taiwan 2019 to Showcase Flexible Electronics Innovations and Opportunities
The latest flexible hybrid electronics (FHE) technology, innovations and industry insights will take center stage at FLEX Taiwan, May 29-30, 2019, at the Taipei International Convention Center (TICC). Organized by FlexTech, a SEMI Strategic Association Partner, the 1.5 day technical conference provides insights into market trends, innovative materials, advanced manufacturing technology and FHE application opportunities such as smart clothing, MedTech and precision sports.
• LEARN about the latest technology developments at the 1.5-day technical conference from 15 keynote speakers from FHE field to make the largest impact on your R&D.
• INTERACT with your customers, suppliers, future partners and academia.
• CONNECT and create the strategic business connections at FLEX Taiwan.